• Ultra-thin and Super-large Aluminum Nitride Ceramic Ring,Ultra-thin Aluminum Nitride Ceramic Ring, Super-large AlN Ceramic Rings, Precision Thin AlN Rings
  • Ultra-thin and Super-large Aluminum Nitride Ceramic Ring,Ultra-thin Aluminum Nitride Ceramic Ring, Super-large AlN Ceramic Rings, Precision Thin AlN Rings

Ultra-thin and Super-large Aluminum Nitride Ceramic Ring

No.AlN_F

Product Name: Ultra-thin and Super-large Aluminum Nitride Ceramic Ring

Product Material: High-purity Aluminum Nitride Ceramic (AlN ≥99.5%)

Material Characteristics:
Ultra-high thermal conductivity (180-200 W/m·K), excellent electrical insulation, low thermal expansion coefficient (4.5×10⁻⁶/°C), high temperature resistance (up to 1800°C), excellent plasma erosion resistance, high mechanical strength, non-toxic and environmentally friendly

Application Fields:
Semiconductor manufacturing, plasma etching equipment, chemical vapor deposition systems, high-power electronic devices

Application Industries:
Wafer processing equipment, LED manufacturing, power module packaging, 5G communication devices

Processing Difficulties:
Large diameter-to-thickness ratio (>50:1) processing, warpage control during sintering, ultra-thin wall machining (thickness <1mm), surface roughness control (Ra ≤0.4μm), dimensional accuracy maintenance

Processing Flow:
Powder preparation → slurry process → tape casting → isostatic pressing → high-temperature sintering → CNC precision machining → laser measurement → ultrasonic cleaning → vacuum packaging

Delivery Period:
35-45 days

  • Ultra-thin and Super-large Aluminum Nitride Ceramic Ring,Ultra-thin Aluminum Nitride Ceramic Ring, Super-large AlN Ceramic Rings, Precision Thin AlN Rings

Description

This ultra-thin and super-large aluminum nitride ceramic ring represents the pinnacle of advanced ceramic manufacturing technology. Specifically engineered for the most demanding semiconductor and electronic applications, it combines exceptional thermal management capabilities with outstanding electrical insulation properties. The large-size design with ultra-thin walls makes it ideal for applications requiring both thermal performance and space efficiency in high-temperature, high-frequency environments.

Key Features:

  • Exceptional Thermal Management - Ultra-high thermal conductivity (180-200 W/m·K) enables efficient heat dissipation in high-power applications

  • Perfect Electrical Insulation - High dielectric strength (≥15 kV/mm) ensures reliable performance in high-voltage environments

  • Superior Thermal Stability - Withstands thermal cycling from room temperature to 1800°C without performance degradation

  • Excellent Plasma Resistance - Maintains structural integrity in corrosive plasma environments

  • Precision Dimensional Control - Advanced manufacturing process ensures tight tolerances (±0.1mm) and excellent surface quality

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