Product Name: High-Quality Ceramic Base Plates
Product Material: Aluminum Nitride (AlN)/Alumina (Al₂O₃)/Silicon Carbide (SiC)
Material Characteristics: High thermal conductivity, excellent thermal shock resistance, electrical insulation, high temperature stability, mechanical strength
Application Fields: Power module substrates, semiconductor packaging, LED heat dissipation, laser equipment, electronic sensors
Application Industries: Power electronics, semiconductor, automotive electronics, aerospace, telecommunications
Processing Challenges: Large-size flatness control, via hole precision, metallization reliability, thermal stress management
Processing Flow: Powder preparation → Forming → High-temperature sintering → Precision grinding → Metallization → Laser processing → Inspection → Packaging
Delivery Time: 30-40 days, 45-60 days for customized designs
High-Quality Ceramic Base Plates are precision-engineered components specifically designed for applications requiring exceptional thermal management performance, reliable operation in extreme temperature environments, and outstanding thermal shock resistance. Manufactured from advanced ceramic materials including aluminum nitride, alumina and silicon carbide, these base plates deliver superior performance in thermal management applications, outperforming traditional materials through their excellent thermal conductivity, electrical insulation properties, and thermal stability.
Key Features:
Exceptional Thermal Conductivity - High thermal conductivity (AlN: 170-200 W/mK, SiC: 120-170 W/mK) provides outstanding heat dissipation performance, ensuring efficient thermal management in high-power applications and significantly reducing device operating temperatures while maintaining structural integrity.
Excellent Thermal Shock Resistance - Withstands rapid temperature changes exceeding 800°C without cracking or degradation, maintaining dimensional stability and mechanical properties in applications involving frequent thermal cycling and extreme temperature variations.
Superior Electrical Insulation - High volume resistivity (>10¹⁴ Ω·cm) and dielectric strength (>15 kV/mm) provide reliable electrical isolation while enabling efficient heat transfer, ensuring safe operation in high-voltage power applications and preventing current leakage risks.
High Temperature Stability - Withstands continuous operation at temperatures up to 1600°C while maintaining excellent mechanical and thermal properties, suitable for extreme temperature environments in power electronics and semiconductor applications.
Excellent Mechanical Strength - High flexural strength (300-400 MPa) and compressive strength (2000-2500 MPa) ensure structural reliability in demanding applications where both thermal management and mechanical support are required.
Precision Dimensional Control - Maintains tight tolerances (±0.02 mm) on critical dimensions and superior surface flatness (<10 μm/in), ensuring perfect thermal contact with mounted components and reliable performance in precision electronic assemblies.
