Ceramic-Metal Sealing Technology Products

Ceramic-Metal Sealing Technology Products are precision-engineered components specifically designed for applications requiring exceptional hermetic sealing performance, reliable operation in extreme environments, and long-term structural stability. Manufactured using advanced ceramic-metal bonding technologies with precisely matched thermal expansion materials, these products deliver superior performance in critical sealing applications, outperforming traditional sealing methods through their excellent thermal stability, reliable interfacial bonding, and vacuum-tight characteristics.

Key Features:

• Advanced Metallization Technology - Implements optimized molybdenum-manganese (Mo-Mn) and active metal brazing processes that create robust ceramic-metal interfaces with bonding strength exceeding 100 MPa, ensuring reliable performance in high-vibration and mechanical shock environments.
• Precision Brazing Encapsulation - Utilizes specialized filler alloys including silver-copper and gold-based systems with precisely controlled brazing parameters, achieving uniform wetting and void-free interfaces that provide consistent sealing performance and enhanced manufacturing yield.
• Exceptional Hermetic Sealing Performance - Achieves outstanding leak-tight integrity with helium leak rates below 1×10⁻¹¹ mbar·L/s, ensuring reliable performance in high-vacuum and high-pressure applications, significantly reducing gas permeation risks in critical systems.
• Optimized Thermal Expansion Matching - Precisely engineered CTE matching between ceramic and metal components (ΔCTE < 0.5×10⁻⁶/K), preventing thermal stress failure and ensuring structural integrity under extreme temperature cycling from -196°C to +850°C.
• Excellent High-Temperature Stability - Withstands continuous operation at temperatures up to 800°C while maintaining sealing integrity and mechanical properties, suitable for high-temperature processing and thermal cycling applications in aerospace and energy systems.
• Superior Vacuum Compatibility - Ultra-clean processing and special surface treatments ensure minimal outgassing rates (<10⁻¹¹ Torr·L/s·cm²), making them ideal for ultra-high vacuum applications in semiconductor and research equipment.