Product Name: Boron Nitride Disc
Material: High-Purity Boron Nitride (BN)
Material Characteristics: High thermal stability, excellent dielectric strength, thermal shock resistance, chemical inertness, smooth surface finish
Application Fields: High-temperature insulation, semiconductor wafer processing, diffusion barriers, furnace components
Application Industries: Semiconductor, electronics, research laboratories, metallurgy
Processing Challenges: Ensuring flatness and parallelism, preventing cracking in thin sections, maintaining surface quality
Processing Flow: Powder preparation → Dry pressing → High-temperature sintering → Surface grinding → Quality inspection → Packaging
Delivery Time: 35-50 days for standard discs, 55-70 days for customized dimensions
Boron Nitride Discs are precision-machined components specifically engineered for applications demanding excellent dielectric properties and thermal stability. Fabricated from high-purity boron nitride, these discs provide outstanding performance in high-temperature insulation applications, offering superior thermal shock resistance and chemical inertness compared to conventional ceramic materials.
Key Features:
High Temperature Capability - Operates reliably at temperatures up to 1800°C in oxidizing atmospheres and 2000°C in inert atmospheres.
Excellent Dielectric Properties - Volume resistivity >10¹⁴ Ω·cm and dielectric strength >15 kV/mm ensure reliable electrical insulation.
Superior Thermal Shock Resistance - Withstands thermal shocks from 1500°C to room temperature without cracking or performance degradation.
Excellent Surface Quality - Achieves surface finish better than Ra 0.8 μm, ensuring optimal performance in semiconductor and electronic applications.
Chemical Inertness - Resists attack from most acids, alkalis, and molten metals, maintaining performance in corrosive environments.
Precision Flatness - Maintains flatness within 0.025 mm per 25 mm diameter, ensuring perfect sealing and thermal contact.
