Product Name: High Thermal Conductivity Ceramic Plates Product Material: Aluminum Nitride (AlN)/Silicon Carbide (SiC)) Material Characteristics: High thermal conductivity, excellent electrical insulation, thermal shock resistance, high temperature stability, low thermal expansion Application Fields: Power electronics cooling, LED heat dissipation, semiconductor packaging, laser equipment, microwave devices Application Industries: Power electronics, semiconductor, telecommunications, automotive electronics, aerospace Processing Challenges: Large-size thin plate flatness control, metallization bonding strength, thermal stress management, surface quality maintenance Processing Flow: Powder preparation → Forming → High-temperature sintering → Precision grinding → Metallization → Inspection → Packaging Delivery Time: 25-35 days, 40-50 days for customized requirements

Place of Origin: Guangdong, China Material:High-purity alumina ceramic, with 99.5%, 99.7% and 99.9% Al₂O₃ grades available depending on application requirements. The material can be selected according to electrical insulation, vacuum compatibility, thermal stability, plasma resistance and mechanical strength requirements. Key Features:Excellent electrical insulation, high temperature resistance, chemical resistance, plasma resistance, low particle generation, good dimensional stability and precision-machined surface finish. These features make the parts suitable for ion beam environments, vacuum systems and precision equipment applications. Application Industries:Used in ion implantation equipment, vacuum systems, plasma processing equipment, advanced material modification systems, research instruments and precision vacuum assemblies. It can also be applied to related vacuum ceramic components and selected semiconductor ceramic parts where high insulation and material stability are required. Lead Time:Based on drawings, material grade, quantity, tolerance, surface finish and inspection requirements. Custom production is available for prototypes, small batches and precision ceramic parts used in ion implantation and vacuum equipment.

Product Name: High Thermal Conductivity Ceramic Plates Product Material: Aluminum Nitride (AlN)/Silicon Carbide (SiC)) Material Characteristics: High thermal conductivity, excellent electrical insulation, thermal shock resistance, high temperature stability, low thermal expansion Application Fields: Power electronics cooling, LED heat dissipation, semiconductor packaging, laser equipment, microwave devices Application Industries: Power electronics, semiconductor, telecommunications, automotive electronics, aerospace Processing Challenges: Large-size thin plate flatness control, metallization bonding strength, thermal stress management, surface quality maintenance Processing Flow: Powder preparation → Forming → High-temperature sintering → Precision grinding → Metallization → Inspection → Packaging Delivery Time: 25-35 days, 40-50 days for customized requirements

Product Name: 0.5mm Small Hole High-Precision Alumina Ceramic Part  Product material: High-purity alumina ceramic (Al₂O₃ 99.6%)  Material properties:  With excellent dielectric strength (>18 kV/mm)  High hardness (HV ≥ 1600)  High-temperature resistant (long-term usage temperature ≥ 1500℃)  Low thermal expansion coefficient (7.2×10⁻⁶/℃)  Resistant to chemical corrosion and with good biocompatibility  Application fields: Semiconductor manufacturing equipment Application industries: Wafer transportation systems, Chip testing platforms, Precision optical equipment  Processing difficulties: Ultra-fine pore size (0.5mm) deep hole processing, with a depth-to-diameter ratio of 10:1  Processing procedure: Powder treatment → Spray granulation → Isostatic pressing → High-temperature sintering → CNC precision machining → Diameter inspection → Ultrasonic cleaning → Vacuum packaging  Delivery period: 30 - 35 days (depending on complexity)

Place of Origin:Guangdong, China Material Introduction:This component can be manufactured with advanced ceramic materials such as Aluminum Nitride Ceramic, Boron Nitride Ceramic, and BeO-based ceramic materials, depending on the working environment. These materials are commonly selected for applications that require heat dissipation, electrical insulation, vacuum stability, and reliable performance in high-voltage electrode assemblies. Functional Features:Designed for focusing electrode assemblies and other high-performance electrical systems, the ceramic component offers good thermal conductivity, stable insulation performance, high dielectric strength, low outgassing, and resistance to thermal shock. Precision machining, polishing, metallization, and ceramic-to-metal joining can be customized according to drawings or assembly requirements. Application Industries:Suitable for semiconductor equipment, electron beam systems, ion beam equipment, vacuum electronic devices, scientific instruments, analytical equipment, aerospace electronics, medical imaging systems, X-ray tubes, traveling-wave tubes, and other high-voltage vacuum applications. Delivery Time:Lead time will be confirmed after reviewing the drawings, material requirements, tolerance standards, quantity, and inspection needs. For custom projects, please contact us with your drawings or technical specifications for evaluation.