Case of Electrostatic Suction Pads on Ceramic Substrates in Semiconductor Wafer Manufacturing
In the key processes such as lithography and etching in semiconductor manufacturing, the wafers need to be fixed extremely flatly, stably and with precise temperature control. Traditional mechanical fixtures carry risks such as contamination and stress damage. This case presents an example of solving the problem of wafer fixation by using high-purity and high-density aluminum nitride ceramics to manufacture electrostatic suction plate substrates.
